Cured product

ABSTRACT

The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.

This application is a National Stage Application of InternationalApplication No. PCT/KR2015/000927 filed on Jan. 28, 2015, which claimsthe benefit of Korean Patent Application No. 10-2014-0010015 filed onJan. 28, 2014, Korean Patent Application No. 10-2014-0010012 filed onJan. 28, 2014, Korean Patent Application No. 10-2014-0010013 filed onJan. 28, 2014, Korean Patent Application No. 10-2014-0010014 filed onJan. 28, 2014 and Korean Patent Application No. 10-2015-0013459 filed onJan. 28, 2015, all of which are hereby incorporated by reference intheir entirety for all purposes as if fully set forth herein.

FIELD

The present application relates to a cured product and the use thereof.

BACKGROUND

Light emitting diodes (LEDs) are devices used in various applicationssuch as a light source of a display device, a lighting device, etc.

As an encapsulant of the LED, an epoxy resin having high adhesiveproperties and excellent dynamic durability is widely used. However, theepoxy resin has problems in that it has low transmittance with respectto light ranging from blue to ultraviolet region and also shows poorheat resistance and light resistance. Accordingly, techniques have beenproposed to solve the above-described problems, for example, such as inPatent documents 1 to 3, etc. However, the encapsulants which have beenknown up to now have insufficient gas barrier properties, adhesiveproperties, or the like, and poor heat resistance, heat and shockdurability, and cracking resistance.

PRIOR ART DOCUMENTS Patent Documents

Patent document 1: Japanese Patent Laid-open Publication No. 1999-274571

Patent document 2: Japanese Patent Laid-open Publication No. 2001-196151

Patent document 3: Japanese Patent Laid-open Publication No. 2002-226551

DESCRIPTION Technical Object

The present application is directed to a cured product and the usethereof.

Technical Solution

According to an aspect of the present application, the cured product maybe a reaction product of a mixture including an aliphatic unsaturatedbond functional polyorganosiloxane and a compound (crosslinking agent)having hydrogen atoms bound to silicon atoms, and for example, may be ahydrosilylation reaction product of the mixture.

The above-described cured product may include, for example, one or moresiloxane units selected from the group consisting of a so-calledmonofunctional siloxane unit (hereinafter, referred to as an M unit)which may be usually represented by (R₃SiO_(1/2)), a so-calleddifunctional siloxane unit (hereinafter, referred to as a D unit) whichmay be usually represented by (R₂SiO_(2/2)), a so-called trifunctionalsiloxane unit (hereinafter, referred to as a T unit) which may beusually represented by (RSiO_(3/2)), and a so-called quadfunctionalsiloxane unit (hereinafter, referred to as a Q unit) which may beusually represented by (SiO_(4/2)). In the formula of each siloxaneunit, R is a functional group bound to silicon (Si), and for example,may be hydrogen, an alkoxy group, an epoxy group, or a monovalenthydrocarbon group.

The cured product may include one or more units represented by thefollowing Formula 1.(R₂SiO_(1/2)A_(1/2))  [Formula 1]

In Formula 1, each R is independently hydrogen, an epoxy group, analkoxy group, or a monovalent hydrocarbon group, and A is an alkylenegroup having 1 to 4 carbon atoms.

The term “epoxy group” used in the present specification, unlessotherwise defined, may denote a cyclic ether having three ring-formingatoms or a monovalent residue derived from a compound including thecyclic ether. Examples of the epoxy group may include a glycidyl group,an epoxy alkyl group, a glycidoxyalkyl group, or alicyclic epoxy group,etc. In the above description, the alicyclic epoxy group may denote amonovalent residue derived from a compound including an aliphatichydrocarbon ring structure and a structure in which two carbon atomsforming the aliphatic hydrocarbon ring also form the epoxy group. Anexample of the alicyclic epoxy group may be an alicyclic epoxy grouphaving 6 to 12 carbon atoms, and for example, may be a 3,4-epoxycyclohexylethyl group, etc.

The term “monovalent hydrocarbon group” used in the presentspecification, unless otherwise defined, may denote a monovalent residuederived from a compound including carbon and hydrogen or a derivative ofthe compound. For example, the monovalent hydrocarbon group may include1 to 25 carbon atoms. Examples of the monovalent hydrocarbon group mayinclude an alkyl group, an alkenyl group, or an akynyl group, etc.

The term “alkyl group or alkoxy group” used in the presentspecification, unless otherwise defined, may denote an alkyl group oralkoxy group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms. The alkylgroup or alkoxy group may have a straight chain, branched chain, or ringshape. Further, the alkyl group or alkoxy group may be arbitrarilysubstituted with one or more substituents.

The term “alkenyl group” used in the present specification, unlessotherwise defined, may denote an alkenyl group having 2 to 20 carbonatoms, 2 to 16 carbon atoms, 2 to 12 carbon atoms, 2 to 8 carbon atoms,or 2 to 4 carbon atoms. The alkenyl group may have a straight chain,branched chain, or ring shape, and may be arbitrarily substituted withone or more substituents.

The term “akynyl group” used in the present specification, unlessotherwise defined, may denote an akynyl group having 2 to 20 carbonatoms, 2 to 16 carbon atoms, 2 to 12 carbon atoms, 2 to 8 carbon atoms,or 2 to 4 carbon atoms. The akynyl group may have a straight chain,branched chain, or ring shape, and may be arbitrarily substituted withone or more substituents.

The term “aryl group” used in the present specification, unlessotherwise defined, may denote a monovalent residue derived from acompound which is connected to a benzene ring or two or more benzenerings, or which includes a structure sharing one or two or more carbonatoms and condensed or bound, or a derivative of the compound. The arylgroup used in the present specification may include a so-called aralkylgroup or arylalkyl group or the like as well as a functional group whichis a so-called aryl group. The aryl group, for example, may be an arylgroup having 6 to 25 carbon atoms, 6 to 21 carbon atoms, 6 to 18 carbonatoms, or 6 to 12 carbon atoms. Examples of the aryl group may include aphenyl group, a dichlorophenyl group, a chlorophenyl group, aphenylethyl group, a phenylpropyl group, a benzyl group, a tolyl group,a xylyl group, a naphthyl group, etc.

In the present specification, examples of the substituent which may bearbitrarily substituted with an epoxy group, an alkoxy group, or amonovalent hydrocarbon group, may include a halogen atom such aschlorine, fluorine or the like, an epoxy group such as a glycidyl group,an epoxy alkyl group, a glycidoxyalkyl group, an alicyclic epoxy groupor the like, an acryloyl group, methacryloyl group, an isocyanate group,a thiol group, a monovalent hydrocarbon group or the like, but are notlimited thereto.

The unit of Formula 1 may be formed by a reaction between the aliphaticunsaturated bond and the hydrogen atoms bound to the silicon atoms in aformation process of the cured product, and accordingly, the ratio(C/Si) may be adjusted by selecting a type, a ratio and/or reactioncondition of a material of the cured product. When the ratio (C/Si) isadjusted in the above-described range, the cured product being suitablefor the desired purpose may be formed, and particularly, the curedproduct having excellent heat resistance, cracking resistance, and heatand shock durability may be provided. In the formation process of thecured product, a specific method of adjusting the ratio (C/Si) will bedescribed below.

In another embodiment, A may be an alkylene group having 1 to 3 carbonatoms, 1 to 2 carbon atoms, or 2 carbon atoms in Formula 1.

The unit of Formula 1 is a unit having a structure in which at least twosilicon atoms (Si) included in the cured product are connected by analkylene group represented by A.

In the cured product, a ratio (C/Si) of the number of moles of carbonatoms (C) which are present in A of Formula 1 to the total number ofmoles of silicon atoms (Si) may be in the range of 0.15 to 0.55. Inanother embodiment, the ratio (C/Si) may be 0.2 or more. Further, instill another embodiment, the ratio (C/Si) may be, for example, 0.5 orless, 0.45 or less, or 0.4 or less.

The ratio may be obtained by performing an NMR analysis, for example, a²⁹Si-NMR analysis with respect to the cured product. The NMR analysis isperformed through nuclear magnetic resonance and a phenomenon in which asubstance including an atomic nucleus (²⁹Si) having magnetic momentabsorbs electromagnetic waves at a specific frequency. The absorptionvaries according to a type of the atomic nuclei, and even when theatomic nuclei are the same, the absorption varies according to chemicalenvironments surrounding the atoms (e.g., a type of atom bound to theatoms). Accordingly, the ratio may be measured through a specificabsorption spectrum represented according to the type of the atomicnucleus or the chemical environments thereof. The cured product isusually a solid at room temperature, and thus a high temperature NMRmethod or a solid phase NMR method may be applied thereto.

The cured product may include an aryl group, for example, the aryl groupbound to the silicon atoms. The aryl group may be included, for example,such that a ratio (Ar/Si) of the number of moles of the aryl group (Ar)to the total number of moles of silicon atoms (Si) is in a range of 0.2to 1.2 or 0.4 to 1.0. When the aryl group is included in theabove-described range, for example, excellent light extractionefficiency may be ensured when the cured product is applied to anoptical semiconductor device such as an LED or the like, and the curedproduct of which gas permeable properties are effectively adjusted maybe provided. The ratio (Ar/Si) may be adjusted by control of the numberof moles of the aryl group and silicon atoms being present in thepolyorganosiloxane or the crosslinking agent forming the cured product.The ratio may be measured using the above-described NMR method.

As described above, the cured product may include one or more siloxaneunits selected from the group consisting of an M, D, T and Q unit, andin the embodiment, the cured product may include at least one of the Tunits, for example, the unit represented by the following Formula 2.(RSiO_(3/2))  [Formula 2]

In Formula 2, R is hydrogen, an epoxy group, an alkoxy group, or amonovalent hydrocarbon group.

The unit of Formula 2, for example, may be included such that a ratio(T/Si) of the number of moles of the T unit (T) to the total number ofmoles of silicon atoms (Si) is in the range of about 0.3 to about 0.6 orabout 0.35 to 0.5. When the T unit is included in the above-describedrange, for example, the cured product having excellent propertiesrequired for the desired purpose such as mechanical strength, gaspermeable properties, or the like may be provided. The ratio (T/Si) maybe adjusted by control of a ratio between the T units and the siliconatoms included in the polyorganosiloxane, the cross linking agent, etc.The ratio may also be measured using the above-described NMR method.

The cured product may include one or more T units including the siliconatoms bound to the aryl group. For example, the T unit including thesilicon atoms bound to the aryl group may be included such that theratio (T/Si) of the number of moles of the T unit (T) to the totalnumber of moles of silicon atoms (Si) is in the range of about 0.19 toabout 0.6, or about 0.3 to about 0.6. When the T unit is included in theabove-described range, for example, excellent light extractionefficiency may be ensured when the cured product is applied to anoptical semiconductor device such as an LED or the like, and the curedproduct of which gas permeable properties are effectively adjusted maybe provided. The ratio (T/Si) may be adjusted by control of a ratiobetween the T units and the silicon atoms included in thepolyorganosiloxane, the cross linking agent, etc. The ratio may also bemeasured using the above-described NMR method.

The cured product may include one or more D units in the above-describedsiloxane units. For example, the D unit may be included such that aratio (D/Si) of the number of moles of the D unit (D) to the totalnumber of moles of silicon atoms (Si) is in the range of about 0.6 orless, 0.55 or less, 0.5 or less, 0.45 or less or 0.4 or less. In anotherembodiment, the ratio (D/Si) may be more than 0, 0.01 or more, 0.05 ormore, 0.1 or more, or 0.15 or more. When the D unit is included in theabove-described range, for example, physical properties such as crackingresistance, heat resistance, and heat and shock durability or the likemay be improved. The ratio (D/Si) may be adjusted by control of a ratiobetween the D units and the silicon atoms included in thepolyorganosiloxane, the cross linking agent, etc. The ratio may also bemeasured using the above-described NMR method.

The cured product may include an epoxy group, for example, one or moreepoxy groups bound to the silicon atoms. The epoxy group, for example,may be included such that a ratio (E/Si) of the number of moles of theepoxy group (E) to the total number of moles of silicon atoms (Si) is inthe range of 0.0001 to 0.15. In another embodiment, the ratio (E/Si) maybe 0.001 or more, 0.005 or more, or 0.008 or more. In still anotherembodiment, the ratio (E/Si) may be, for example, about 0.1 or less, orabout 0.05 or less. When the epoxy group is included in theabove-described range, the cured product having excellent adhesiveproperties to be applied for the various purposes may be provided. Theratio (E/Si) may be adjusted by control of a ratio between the epoxygroups and the silicon atoms included in the polyorganosiloxane and thecross linking agent.

The cured product may include one or more alkenyl groups bound to thesilicon atoms. Usually, the cured product formed by a reaction betweenthe aliphatic unsaturated bond such as the alkenyl group and thehydrogen atoms bound to the silicon atoms is formed such that all thealiphatic unsaturated bond which is a reactive functional group and thehydrogen atoms bound to the silicon atoms are exhausted (used up), but acertain amount of the alkenyl group may be present in the cured product.The alkenyl group, for example, may be included such that a ratio(Ak/Si) of the number of moles of the alkenyl group (Ak) to the totalnumber of moles of silicon atoms (Si) is more than 0, or 0.001 or more,about 0.15 or less, or about 0.1 or less. This may improve physicalproperties such as cracking resistance, heat resistance, and heat andshock durability, etc. The ratio (Ak/Si) may be obtained by adjusting aratio of the alkenyl group which is the aliphatic unsaturated bond to behigher than that of the hydrogen atoms bound to the silicon atoms whichreact therewith in the mixture forming the cured product, or byadjusting the curing conditions so as to remain the alkenyl group. Theratio may also be measured using the above-described NMR method.

The alkenyl group, for example, may be included in the M unit. Forexample, the cured product may include the unit of the following Formula3 as the M unit.(R¹R² ₂SiO_(1/2))  [Formula 3]

In Formula 3, R¹ is an alkenyl group, and R² is a monovalent hydrocarbongroup, and for example, may be an alkyl group.

The unit of Formula 3 is the M unit including at least one alkenylgroup, and this unit, for example, may be included such that a ratio(V/Si) of the number of moles of the M unit (V) to the total number ofmoles of silicon atoms (Si) in the cured product is more than 0, 0.001or more, about 0.15 or less, or about 0.1 or less. Accordingly, thecured product having suitable physical properties may be obtained.

The cured product may be obtained by reacting the mixture including thealiphatic unsaturated bond functional polyorganosiloxane and thecompound (cross linking agent) having the hydrogen atoms bound to thesilicon atoms, for example, by a hydrosilylation reaction thereof. Inthe above-described process, the alkylene group may be generated by areaction between the aliphatic unsaturated bond and the hydrogen atoms,and thereby generating the unit of Formula 1.

Accordingly, the unit of Formula 1 and the ratios (e.g., C/Si, Ak/Si,etc.) may be basically adjusted by adjusting the ratio between thealiphatic unsaturated bond included in the polyorganosiloxane to thehydrogen atoms being present in the crosslinking agent, and the ratiobetween the catalysts promoting the reaction thereof.

However, in the present invention, it was determined that the adjustmentof the ratio is difficult by simply adjusting the ratio between thealiphatic unsaturated bond included in the polyorganosiloxane to thehydrogen atoms being present in the crosslinking agent, and the reactionenvironment is required to be considered as well. For example, theoptical semiconductor such as an LED or the like in which the curedproduct is mainly used may have various materials for housing such as apolyphthalamide (PPA), polycyclohexylene-dimethylene terephthalates(PCT), an epoxy molding compound (EMC), a white silicone, or the like,and one of the above-described housing materials may be selected to beused according to the purpose. The curing process to form the curedproduct is usually performed in a state in which the curablecomposition, that is, the mixture including the polyorganosiloxane andthe crosslinking agent is injected into the housing material. In theabove-described curing process, outgassing is largely generatedaccording to the housing materials, the reaction between the aliphaticunsaturated bond and the hydrogen atoms decreases, and thus the desiredratio (C/Si) may not be obtained.

Accordingly, it may be advantageous to select the housing materialcausing less outgassing, or to perform an injection of the curablecomposition and the curing process after performing a prebaking processfor the housing material causing outgassing to obtain the ratio (C/Si).

In addition to the above description, the factors related to curing ofthe curable composition are various, and the curing reaction is requiredto be performed to obtain the ratio (C/Si, etc.) in consideration of thefactors.

In the above description, as the aliphatic unsaturated bond functionalpolyorganosiloxane, for example, a polyorganosiloxane having the averageunit of the following Formula 4 may be used.P_(a)Q_(b)SiO_((4-a-b)/2)  [Formula 4]

In Formula 4, P is an alkenyl group, Q is an epoxy group, an alkoxygroup, or a monovalent hydrocarbon group, a and b are numbers such thata+b is in the range of 1 to 2.2, and a/(a+b) is in the range of 0.001 to0.15.

In another embodiment, a+b may be 1.1 or more, 1.2 or more, 1.3 or more,or 1.4 or more in Formula 4. Further, in still another embodiment, a+bmay be 2.1 or less, 2.0 or less, or 1.9 or less in Formula 4.

In still another embodiment, a/(a+b) may be 0.005 or more, 0.01 or more,0.03 or more, or 0.06 or more in Formula 4. Further, in still anotherembodiment, a/(a+b) may be 0.4 or less, 0.3 or less, 0.25 or less, 0.2or less, or 0.15 or less in Formula 4.

In the present specification, “polyorganosiloxane has a specific averageunit” may include the case in which the polyorganosiloxane is a mixtureof two or more components and represented by the average unit of thecomposition of the mixture as well as the case in which thepolyorganosiloxane is a single component having the average unit.

In the embodiment, the polyorganosiloxane having the average unit ofFormula 4 may include at least one of a linear polyorganosiloxane, apartially crosslinked polyorganosiloxane or a crosslinkedpolyorganosiloxane.

In the present specification, the term “linear polyorganosiloxane” maydenote a polyorganosiloxane including only M and D units as a siloxaneunit, the term “partially crosslinked polyorganosiloxane” may denote apolyorganosiloxane including the T or Q unit together with the D unit,and having a structure of a sufficiently long linear structure derivedfrom the D unit, in which a ratio of the D units to the total number ofD, T and Q units (D/(D+T+Q)) is 0.7 or more and less than 1. In thepresent specification, the term “crosslinked polyorganosiloxane” maydenote a polyorganosiloxane essentially including the T or Q unit, inwhich the ratio (D/(D+T+Q)) is 0 or more and less than 0.7.

In Formula 4, at least one Q may be an aryl group. For example, inFormula 4, the aryl group of Q may be present in the amount allowing aratio (Ar/Si) of the number of moles of the aryl group (Ar) to the totalnumber of moles of silicon atoms included in the polyorganosiloxane (Si)to be in the range of 0.3 to 1.0, or 0.5 to 1.0.

In Formula 4, at least one Q may be an epoxy group. For example, inFormula 4, the epoxy group of Q may be present in the amount allowing aratio (E/Si) of the number of moles of the epoxy group (E) to the totalnumber of moles of silicon atoms included in the polyorganosiloxane (Si)to about 0.2 or less, about 0.15 or less, about 0.1 or less, about 0.05or less, or about 0.03 or less.

The polyorganosiloxane which is the average unit of Formula 4, forexample, may have a weight-average molecular weight (Mw) in the range ofabout 1,000 to 10,000, about 1,500 to about 8,000, about 1,500 to 6,000,about 1,500 to 4,000, or about 1,500 to 3,000. In the presentspecification, the term “weight-average molecular weight” may denote aconversion value of a standard polystyrene measured by gel permeationchromatograph (GPC). Unless otherwise defined, the term “molecularweight” may denote a weight-average molecular weight. When a molecularweight of the polyorganosiloxane which is the average unit of Formula 4is adjusted in the above-described range, formability and workabilitybefore curing, or strength after curing may be effectively maintained.

The compound including hydrogen atoms bound to silicon atoms, which isincluded in the mixture, for example, may be a linear, a partiallycrosslinked, or a crosslinked polyorganosiloxane having at least one ofthe hydrogen atoms.

For example, the compound may have an average unit of the followingFormula 5.H_(c)Q_(d)SiO_((4-c-d)/2)  [Formula 5]

In Formula 5, Q is an epoxy group, an alkoxy group, or a monovalenthydrocarbon group, and c and d are numbers such that c+d is in the rangeof 1 to 2.8, and c/(c+d) is in the range of 0.001 to 0.34.

In another embodiment, in Formula 5, c+d may be in the range of 1.5 to2.8, about 2 to 2.8, or about 2.3 to 2.8. Further, in Formula 5, c/(c+d)may be in the range of about 0.005 to 0.34, about 0.01 to 0.34, about0.05 to 0.34, about 0.1 to 0.34 or about 0.15 to 0.34.

The above-described compound may be a curing agent capable of formingthe cured product by reacting the aliphatic unsaturated bond of theabove-described aliphatic unsaturated bond functionalpolyorganosiloxane, and crosslinking the mixture. For example, anaddition reaction between the hydrogen atoms of the compound and thealiphatic unsaturated bond of the aliphatic unsaturated bond functionalpolyorganosiloxane may form the cured product.

In the average unit of Formula 5, at least one Q may be an aryl group.For example, the aryl group of Q may be present in the amount such thata ratio (Ar/Si) of the number of moles of the aryl group (Ar) to thetotal number of moles of total silicon atoms (Si) included in thecompound having the average unit of Formula 5 is, for example, in therange of 0.25 or more, 0.3 or more, 0.3 to 1.0, or 0.5 to 1.0.

The compound having the average unit of Formula 5 may be solid orliquid. When the compound is a liquid, a viscosity thereof at 25° C. maybe in the range of 300 mPa·s or less, or 300 mPa·s or less. When theviscosity is controlled as described above, processability of themixture, hardness properties of the cured product may be excellentlymaintained. The compound, for example, may have a molecular weight ofless than 1,000, or less than 800. When the molecular weight is adjustedin the above-described range, strength of the cured product or the likemay be maintained in a suitable range. The lower limit of the molecularweight of the compound is not particularly limited, and for example, maybe 250.

As the compound having the average unit of Formula 5, various types ofthe compound may be used as long as the compound satisfies theproperties as described above. For example, a compound of the followingFormula 6 may be used as the compound.

In Formula 6, each R is independently hydrogen, an epoxy group, or amonovalent hydrocarbon group, and n is a number in the range of 1 to 10.In Formula 6, R may be, for example, an aryl group or an alkyl group,and may be an alkyl group or an aryl group in the range satisfying aratio (Ar/Si) of the aryl group of the compound having the average unitof the compound.

In Formula 6, n may be, for example, in the range of 1 to 8, 1 to 6, 1to 4, 1 to 3 or 1 to 2.

A ratio, a viscosity, or a molecular weight of the aryl group of thecompound of Formula 6 may be in the above-described range.

A content of the compound including the hydrogen atoms bound to thesilicon atoms, for example, such as the compound having the average unitof Formula 5 or the compound of Formula 6 may be selected in the rangein which the mixture has the above-described properties after curing.For example, the content of the compound may be selected in the range inwhich a ratio (H/Ak) of the number of moles of the hydrogen atoms of thecompound (H) to the number of moles of the aliphatic unsaturated bond ofthe aliphatic unsaturated bond functional polyorganosiloxane (Ak) is inthe range of 0.5 to 3.0, 0.7 to 2, or 1.05 to 1.3.

The mixture may further include a hydrosilylation catalyst. Thehydrosilylation catalyst may be used to promote a hydrosilylationreaction. All typical components known in the related field may be usedas the hydrosilylation catalyst. Examples of the catalyst may includeplatinum, palladium, a rhodium-based catalyst, etc. A platinum-basedcatalyst may be used in consideration of catalyst efficiency, andexamples of the platinum-based catalyst may include chloroplatinic acid,platinum tetrachloride, olefin complexes of platinum, alkenylsiloxanecomplexes of platinum or carbonyl complexes of platinum or the like, butare not limited thereto.

A content of the hydrosilylation catalyst is not particularly limited aslong as the hydrosilylation catalyst is included in a so-called catalystamount, that is, in the amount acting as the catalyst. Usually, thecontent of 0.1 to 200 ppm, or 0.2 to 100 ppm based on an atomic weightof platinum, palladium, or rhodium may be used.

Further, the mixture may further include a tackifier in terms of anadditional improvement of adhesive properties with respect to variousbase materials. The tackifier, as a component capable of improvingself-adhesive properties, may particularly improve self-adhesiveproperties with respect to metals and organic resins.

Examples of the tackifier may include a silane having at least one type,or at least two types of functional groups selected from the groupconsisting of an alkenyl group such as a vinyl group, a(meth)acryloyloxy group, a hydrosilyl group (—SiH), an epoxy group, analkoxy group, an alkoxy silyl group, a carbonyl group, and a phenylgroup; or an organic silicon compound such as a cyclic or linearsiloxane having 2 to 30, or 4 to 20 silicon atoms, but are not limitedthereto. In the embodiment of the present application, one type or twoor more types of the above-described tackifiers may be further mixed andused.

When the tackifier is included, for example, the tackifier may beincluded in the ratio of 0.1 to 20 parts by weight with respect to 100parts by weight of solid fractions of the mixture, but the content maybe suitably modified in consideration of a desired improvement effect ofthe adhesive properties, etc.

The mixture may further include one type or two or more types ofadditives including a reaction inhibitor such as 2-methyl-3-butyne-2-ol,2-phenyl-3-1-butyne-2-ol, 3-methyl-3-pentene-1-yne,3,5-dimethyl-3-hexene-1-yne,1,3,5,7-tetramethyl-1,3,5,7-tetrahexenylcyclotetrasiloxane,ethynylcyclohexane, or the like; an inorganic filler such as silica,alumina, zirconia, titania, or the like; a carbon-functional silanehaving an epoxy group and/or an alkoxysilyl group, a partialhydrolysis-condensation product thereof or a siloxane compound; athixotropic agent such as a haze-phase silica or the like which can beused in combination with polyether; a filler; a phosphor; a conductivityproviding agent such as metal powder of silver, copper, aluminum, or thelike, or various carbon materials, or the like; or a color adjustingagent such as a pigment, dye, or the like, as needed.

Conditions of forming the cured product by curing the mixture are setsuch that the final cured product includes the above-describedcomposition. For example, the cured product may be formed by maintainingthe mixture at a temperature of about 60 to 200° C. for 10 minutes to 5hours.

According to another aspect of the present application, there isprovided a semiconductor device, for example, an optical semiconductordevice. An illustrative semiconductor device may be encapsulated by anencapsulant including the cured product. Examples of a semiconductordevice encapsulated by an encapsulant may include a diode, a transistor,a thyristor, a photocoupler, a charge-coupled device (CCD), asolid-phase image pick-up device, a monolithic integrated circuit (IC),a hybrid IC, an large-scale integration (LSI), a very-large-scaleintegration (VLSI), a light-emitting diode (LED), etc. In oneembodiment, the semiconductor device may be an LED.

An example of the LED may include, for example, an LED formed bystacking a semiconductor material on a substrate. Examples of thesemiconductor material may include, but are not limited to, GaAs, GaP,GaAlAs, GaAsP, AlGaInP, GaN, InN, AlN, InGaAlN, SiC, etc. Further,examples of the substrate may include sapphire, spinel, SiC, Si, ZnO, aGaN single crystalline, etc.

Upon manufacture of the LED, when necessary, a buffer layer may beformed between a substrate and a semiconductor material. As the bufferlayer, GaN or AlN may be used. A method of stacking the semiconductormaterial on the substrate may be, but is not particularly limited to, anMOCVD method, a HDVPE method, a liquid growth method, etc. Further, astructure of the LED may be, for example, a monojunction including anMIS junction, a PN junction, and a PIN junction, a heterojunction, adouble heterojunction, etc. Further, the LED may be formed using a monoor multiple quantum well structure.

In one embodiment, an emission wavelength of the LED may be, forexample, 250 to 550 nm, 300 to 500 nm, or 330 to 470 nm. The emissionwavelength may denote a main emission peak wavelength. When the emissionwavelength of the LED is set in the above-described range, a white LEDhaving a longer lifetime, high energy efficiency and high colorexpression may be obtained.

The LED may be encapsulated by the cured product, and accordingly, theencapsulation process of the LED may be performed using theabove-described mixture. The encapsulation of the LED may be performedonly using the mixture, and in some cases, another encapsulant may beused in combination with the mixture. When two types of encapsulants areused in combination, after the encapsulation using the mixture, theencapsulated LED may also be encapsulated with another encapsulant.Alternatively, the LED may be first encapsulated with the otherencapsulant and then encapsulated again with the mixture. Examples ofthe other encapsulant may include an epoxy resin, a silicone resin, anacryl resin, a urea resin, an imide resin, glass, etc.

As a method of encapsulating the LED with the mixture, for example, amethod including injecting the mixture into a mold in advance, dipping alead frame to which the LED is fixed therein, and then curing thecomposition, etc. A method of injecting the mixture may includeinjection by a dispenser, transfer molding, injection molding, etc.Further, as other encapsulating methods, a method of coating the LEDwith the mixture by dropping, screen printing, or a mask, and curing themixture, a method of injecting the mixture into a cup in which the LEDis disposed on its bottom by a dispenser, and curing the mixture, or thelike may be included.

The mixture may be used as a die bond material for bonding the LED in alead terminal or package, a passivation film on the LED, a packagesubstrate, etc.

A shape of the encapsulant is not particularly limited, and for example,the encapsulant may be made in the form of a bullet-shaped lens, a plateor a thin film.

Further improvement of a performance of the LED may be achievedaccording to conventional known methods. Examples of a method ofimproving the performance may include, for example, a method of forminga reflective layer or light collecting layer on a back surface of theLED, a method of forming a complementary coloring portion on a bottomportion of the LED, a method of forming a layer for absorbing lighthaving a shorter wavelength than the main emission peak on the LED, amethod of encapsulating the LED and further molding the LED with a hardmaterial, a method of fixedly inserting the LED into a through hole, amethod of bonding the LED with a lead member by flip-chip bonding toextract light from a direction of the substrate, etc.

The optical semiconductor, for example, the LED may be effectivelyapplied to, for example, backlights of a liquid crystal display device(LCD), lightings, various types of sensors, light sources of a printerand a copy machine, light sources for an automobile gauge, trafficlights, pilot lamps, display devices, light sources of planar-type LEDs,displays, ornaments or various lightings, etc.

Effect

When the illustrative cured product, for example, is applied to asemiconductor device such as an LED or the like, the decrease inbrightness may be minimized even upon the long-term use of the device,and since the cured product has excellent cracking resistance, thedevice having high long-term reliability may be provided. The curedproduct has excellent processability, workability, and adhesiveproperties or the like, and does not cause whitening and surfacestickiness, etc. Further, the cured product exhibits excellent heatresistance at high temperature, gas barrier properties, etc. The curedproduct may be, for example, applied as an encapsulant or an adhesivematerial of a semiconductor device.

Embodiments

Hereinafter, the mixture will be described in detail with reference toexamples and comparative examples. However, the scope of the mixture isnot limited by the following examples.

Hereinafter, the abbreviation “Vi” refers to a vinyl group, theabbreviation “Ph” refers to a phenyl group, the abbreviation “Me” refersto a methyl group, and the abbreviation “Ep” refers to a3-glycidoxypropyl group.

Physical properties of cured products prepared in the examples andcomparative examples were measured by the following methods.

1. Mole Fraction Evaluation Method

Silicon atoms connected by an ethylene group which is present in a curedproduct, a ratio (C/Si) of the number of moles of carbon atoms (C) whichare present in the ethylene group to the total number of moles ofsilicon atoms (Si), or the like were measured according to a well-known²⁹Si NMR method. A reference compound used upon a measurement by ²⁹SiNMR was dilute tetramethylsilane (TMS) dissolved in CDCl₃, and achemical shift thereof was measured.

2. Long-Term Reliability at High Temperature

Properties of a device were evaluated using an LED package prepared by apolyphthalamide (PPA) or a polycyclohexyl phthalamide (PCT).Specifically, a surface-mount type LED was prepared by dispensing amixture prepared in a PPA or PCT cup, and curing it under conditionsrepresented in the examples or comparative examples. Subsequently, afterthe prepared LED operated for 1,000 hours with current of 50 mA whilebeing maintained at 85° C., a brightness decreasing rate after operationwith respect to initial brightness before the operation was measured,and thereby reliability was evaluated based on the following standard.

[Evaluation Standard]

A: brightness decreasing rate was 5% or less

B: brightness decreasing rate was more than 5% but 10% or less

C: brightness decreasing rate was more than 10%

3. Heat and Shock Durability

After 1 cycle was defined as maintaining the LED package at −40° C. for15 minutes and then maintaining the LED package at 100° C. for 15minutes again, and 200 cycles were repeated, the number of turned-offpackages with respect to 20 of the total evaluated packages wasevaluated, and thereby heat and shock durability was evaluated.

Example 1

125.5 g of an aliphatic unsaturated bond functional polyorganosiloxanehaving an average unit of the following Formula A, and having aweight-average molecular weight of about 2,300, and 23.5 g of a compoundof the following Formula B were mixed, a catalyst of platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane in which a content of Pt(0) was 2 ppm was also mixed therein, and thereby a mixture (curablecomposition) was prepared. Subsequently, the prepared mixture wasmaintained at 140° C. for 1 hour, and thereby a cured product wasprepared. Curing of the cured product was performed after dispensing themixture in the PPA cup. It was determined that the cured productincluded a 3-glycidoxy propyl group, and a ratio (E/Si) of the number ofmoles of the 3-glycidoxy propyl group (E) to the total number of molesof silicon atoms (Si) was about 0.01. Further, the cured product wasdetermined to include silicon atoms connected by an ethylene group, anda ratio (C/Si) of the number of moles of carbon atoms (C) which werepresent in the ethylene group to the total number of moles of siliconatoms (Si) was about 0.23. Further, a ratio (Ar/Si) of the total numberof moles of aryl groups (Ar) which were present in the cured product tothe total number of moles of silicon atoms (Si) was about 0.76, a ratio(T/Si) of the total number of moles of T units (T) in the cured productto the total number of moles of silicon atoms (Si) was about 0.43, aratio (D/Si) of the total number of moles of D units (D) in the curedproduct to the total number of moles of silicon atoms (Si) was about0.29, and a ratio (V/Si) of the total number of moles of vinyl groups(V) in the cured product to the total number of moles of silicon atoms(Si) was 0.(ViMe₂SiO_(1/2))_(0.18)(MeEpsiO_(2/2))_(0.02)(MePhSiO_(2/2))_(0.27)(PhSiO_(3/2))_(0.53)  [FormulaA](HMe₂SiO_(1/2))₂(Ph₂SiO_(2/2))  [Formula B]

Example 2

123.2 g of an aliphatic unsaturated bond functional polyorganosiloxanehaving an average unit of the following Formula C, and having aweight-average molecular weight of about 2,550, and 23.5 g of a compoundof the following Formula B were mixed, a catalyst of platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane in which a content of Pt(0) was 2 ppm was also mixed therein, and thereby a mixture (curablecomposition) was prepared. Subsequently, the mixture (curablecomposition) was dispensed in a PCT cup, was maintained at 140° C. for 1hour, and thereby a cured product was prepared in the same manner as inExample 1. It was determined that the cured product included a3-glycidoxy propyl group, and a ratio (E/Si) of the number of moles ofthe 3-glycidoxy propyl group (E) to the total number of moles of siliconatoms (Si) was about 0.01. The cured product included silicon atomsconnected by an ethylene group, and a ratio (C/Si) of the number ofmoles of carbon atoms (C) which were present in the ethylene group tothe total number of moles of silicon atoms (Si) was about 0.23. Further,a ratio (Ar/Si) of the total number of moles of aryl groups (Ar) whichwere present in the cured product to the total number of moles ofsilicon atoms (Si) was about 0.74, a ratio (T/Si) of the total number ofmoles of T units (T) in the cured product to the total number of molesof silicon atoms (Si) was about 0.43, a ratio (D/Si) of the total numberof moles of D units (D) to the total number of moles of silicon atoms(Si) was about 0.27, and a ratio (V/Si) of the total number of moles ofvinyl groups (V) in the cured product to the total number of moles ofsilicon atoms (Si) was 0.(ViMe₂SiO_(1/2))_(0.18)(MeEpSiO_(2/2))_(0.02)(MePhSiO_(2/2))_(0.24)(PhSiO_(3/2))_(0.53)(SiO_(4/2))_(0.03)  [FormulaC]

Example 3

127.4 g of an aliphatic unsaturated bond functional polyorganosiloxanehaving an average unit of the following Formula D, and having aweight-average molecular weight of about 2,300, and 23.5 g of a compoundof the following Formula B were mixed, a catalyst of platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane in which a content of Pt(0) was 2 ppm was also mixed therein, and thereby a mixture (curablecomposition) was prepared. Subsequently, the mixture (curablecomposition) was dispensed in a PCT cup, was maintained at 140° C. for 1hour, and thereby a cured product was prepared in the same manner as inExample 1. It was determined that the cured product included a3-glycidoxy propyl group, and a ratio (E/Si) of the number of moles ofthe 3-glycidoxy propyl group (E) to the total number of moles of siliconatoms (Si) was about 0.05. The cured product included silicon atomsconnected by an ethylene group, and a ratio (C/Si) of the number ofmoles of carbon atoms (C) which were present in the ethylene group tothe total number of moles of silicon atoms (Si) was about 0.23. Further,a ratio (Ar/Si) of the total number of moles of aryl groups (Ar) whichwere present in the cured product to the total number of moles ofsilicon atoms (Si) was about 0.73, a ratio (T/Si) of the total number ofmoles of T units (T) in the cured product to the total number of molesof silicon atoms (Si) was about 0.43, a ratio (D/Si) of the total numberof moles of D units (D) to the total number of moles of silicon atoms(Si) was about 0.29, and a ratio (V/Si) of the total number of moles ofvinyl groups (V) in the cured product to the total number of moles ofsilicon atoms (Si) was 0.(ViMe₂SiO_(1/2))_(0.18)(MeEpSiO_(2/2))_(0.07)(MePhSiO_(2/2))_(0.22)(PhSiO_(3/2))_(0.53)  [FormulaD]

Example 4

130.5 g of an aliphatic unsaturated bond functional polyorganosiloxanehaving an average unit of the following Formula E, and having aweight-average molecular weight of about 2,100, and 23.5 g of a compoundof the following Formula B were mixed, a catalyst of platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane in which a content of Pt(0) was 2 ppm was also mixed therein, and thereby a mixture (curablecomposition) was prepared. Subsequently, the prepared mixture wasdispensed in a PCT cup, was maintained at 140° C. for 1 hour, andthereby a cured product was prepared. In the above description, a PCTcup prebaked at 160° C. for about 30 minutes before dispensing themixture was used as the PCT cup in which the mixture was dispensed. Itwas determined that the cured product included a 3-glycidoxy propylgroup, and a ratio (E/Si) of the number of moles of the 3-glycidoxypropyl group (E) to the total number of moles of silicon atoms (Si) wasabout 0.1. The cured product included silicon atoms connected by anethylene group, and a ratio (C/Si) of the number of moles of carbonatoms (C) which were present in the ethylene group to the total numberof moles of silicon atoms (Si) was about 0.23. Further, a ratio (Ar/Si)of the total number of moles of aryl groups (Ar) which were present inthe cured product to the total number of moles of silicon atoms (Si) wasabout 0.68, a ratio (T/Si) of the total number of moles of T units (T)in the cured product to the total number of moles of silicon atoms (Si)was about 0.43, a ratio (D/Si) of the total number of moles of D units(D) to the total number of moles of silicon atoms (Si) was about 0.29,and a ratio (V/Si) of the total number of moles of vinyl groups (V) inthe cured product to the total number of moles of silicon atoms (Si) was0.(ViMe₂SiO_(1/2))_(0.18)(MeEpSiO_(2/2))_(0.15)(MePhSiO_(2/2))_(0.14)(PhSiO_(3/2))_(0.53)  [FormulaE]

Comparative Example 1

124.5 g of an aliphatic unsaturated bond functional polyorganosiloxanehaving an average unit of the following Formula F, and having aweight-average molecular weight of about 2,300, and 23.5 g of a compoundof the following Formula B were mixed, a catalyst of platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane in which a content of Pt(0) was 2 ppm was also mixed therein, and thereby a mixture (curablecomposition) was prepared. Subsequently, the mixture (curablecomposition) was dispensed in a PCT cup, was maintained at 140° C. for 1hour, and thereby a cured product was prepared in the same manner as inExample 1. The cured product did not include an epoxy group bound tosilicon atoms. It was determined that the cured product included siliconatoms connected by an ethylene group, and a ratio (C/Si) of the numberof moles of carbon atoms (C) which were present in the ethylene group tothe total number of moles of silicon atoms (Si) was about 0.23. Further,a ratio (Ar/Si) of the total number of moles of aryl groups (Ar) whichwere present in the cured product to the total number of moles ofsilicon atoms (Si) was about 0.79, a ratio (T/Si) of the total number ofmoles of T units (T) in the cured product to the total number of molesof silicon atoms (Si) was about 0.48, a ratio (D/Si) of the total numberof moles of D units (D) to the total number of moles of silicon atoms(Si) was about 0.27, and a ratio (V/Si) of the total number of moles ofvinyl groups (V) in the cured product to the total number of moles ofsilicon atoms (Si) was 0.(ViMe₂SiO_(1/2))_(0.18)(MePhSiO_(2/2))_(0.25)(PhSiO_(3/2))_(0.57)  [FormulaF]

Comparative Example 2

134.2 g of an aliphatic unsaturated bond functional polyorganosiloxanehaving an average unit of the following Formula G, and 19.6 g of acompound of the following Formula B were mixed, a catalyst of platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane in which a content of Pt(0) was 2 ppm was also mixed therein, and thereby a mixture (curablecomposition) was prepared. Subsequently, the mixture (curablecomposition) was dispensed in a PCT cup, was maintained at 140° C. for 1hour, and thereby a cured product was prepared in the same manner as inExample 1. It was determined that the cured product included a3-glycidoxy propyl group, and a ratio (E/Si) of the number of moles ofthe 3-glycidoxy propyl group (E) to the total number of moles of siliconatoms (Si) was about 0.17. The cured product was determined to includesilicon atoms connected by an ethylene group, and a ratio (C/Si) of thenumber of moles of carbon atoms (C) which were present in the ethylenegroup to the total number of moles of silicon atoms (Si) was about 0.20.Further, a ratio (Ar/Si) of the total number of moles of aryl groups(Ar) which were present in the cured product to the total number ofmoles of silicon atoms (Si) was about 0.65, a ratio (T/Si) of the totalnumber of moles of T units (T) in the cured product to the total numberof moles of silicon atoms (Si) was about 0.43, a ratio (D/Si) of thetotal number of moles of D units (D) to the total number of moles ofsilicon atoms (Si) was about 0.35, and a ratio (V/Si) of the totalnumber of moles of vinyl groups (V) in the cured product to the totalnumber of moles of silicon atoms (Si) was 0.(ViMe₂SiO_(1/2))_(0.15)(MeEpSiO_(2/2))_(0.21)(MePhSiO_(2/2))_(0.14)(PhSiO_(3/2))_(0.50)  [FormulaG]

Comparative Example 3

130.5 g of an aliphatic unsaturated bond functional polyorganosiloxanehaving an average unit of the following Formula H, and having aweight-average molecular weight of about 2,100, and 26.1 g of a compoundof the following Formula B were mixed, a catalyst of platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane in which a content of Pt(0) was 2 ppm was also mixed therein, and thereby a mixture (curablecomposition) was prepared. Subsequently, the mixture (curablecomposition) was dispensed in a PCT cup, was maintained at 140° C. for 1hour, and thereby a cured product was prepared in the same manner as inExample 1. It was determined that the cured product included a3-glycidoxy propyl group, and a ratio (E/Si) of the number of moles ofthe 3-glycidoxy propyl group (E) to the total number of moles of siliconatoms (Si) was about 0.17. The cured product was determined to includesilicon atoms connected by an ethylene group, and a ratio (C/Si) of thenumber of moles of carbon atoms (C) which were present in the ethylenegroup to the total number of moles of silicon atoms (Si) was about 0.26.Further, a ratio (Ar/Si) of the total number of moles of aryl groups(Ar) which were present in the cured product to the total number ofmoles of silicon atoms (Si) was about 0.51, a ratio (T/Si) of the numberof moles of total T units (T) in the cured product to the total numberof moles of silicon atoms (Si) was about 0.38, a ratio (D/Si) of thetotal number of moles of D units (D) to the total number of moles ofsilicon atoms (Si) was about 0.25, and a ratio (V/Si) of the totalnumber of moles of vinyl groups (V) in the cured product to the totalnumber of moles of silicon atoms (Si) was 0.(ViMe₂SiO_(1/2))_(0.2)(MeEpSiO_(2/2))_(0.22)(MePhSiO_(2/2))_(0.1)(PhSiO_(3/2))_(0.45)(SiO_(4/2))_(0.03)  [FormulaH]

Comparative Example 4

130.5 g of an aliphatic unsaturated bond functional polyorganosiloxanehaving an average unit of the following Formula I, and having aweight-average molecular weight of about 2,100, and 23.5 g of a compoundof the following Formula B were mixed, a catalyst of platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane in which a content of Pt(0) was 2 ppm was also mixed therein, and thereby a mixture (curablecomposition) was prepared. Subsequently, the prepared mixture wasdispensed in a PCT cup, was maintained at 140° C. for 1 hour, andthereby a cured product was prepared. In the above description, a PCTcup which was not prebaked was used as the PCT cup in which the mixturewas dispensed. The cured product did not include a 3-glycidoxy propylgroup bound to the silicon atoms. It was determined that the curedproduct included silicon atoms connected by an ethylene group, and aratio (C/Si) of the number of moles of carbon atoms (C) which werepresent in the ethylene group to the total number of moles of siliconatoms (Si) was about 0.08. Further, a ratio (Ar/Si) of the number ofmoles of total aryl groups (Ar) which were present in the cured productto the total number of moles of silicon atoms (Si) was about 0.68, aratio (T/Si) of the total number of moles of T units (T) in the curedproduct to the total number of moles of silicon atoms (Si) was about0.43, a ratio (D/Si) of the total number of moles of D units (D) to thetotal number of moles of silicon atoms (Si) was about 0.29, and a ratio(V/Si) of the total number of moles of vinyl groups (V) in the curedproduct to the total number of moles of silicon atoms (Si) was 0.(ViMe₂SiO_(1/2))_(0.18)(MePhSiO_(2/2))_(0.14)(PhSiO_(3/2))_(0.53)  [FormulaI]

Comparative Example 5

The cured product was prepared in the same manner as in ComparativeExample 4 except that the PCT cup prebaked in the same manner as inExample 4 was used and a mixture mixed with a catalyst(platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane) in which acontent of Pt (0) was 0.2 ppm was used. The cured product did notinclude a 3-glycidoxy propyl group bound to the silicon atoms. It wasdetermined that the cured product included silicon atoms connected by anethylene group, and a ratio (C/Si) of the number of moles of carbonatoms (C) which were present in the ethylene group to the total numberof moles of silicon atoms (Si) was about 0.13. Further, a ratio (Ar/Si)of the total number of moles of aryl groups (Ar) which were present inthe cured product to the total number of moles of silicon atoms (Si) wasabout 0.68, a ratio (T/Si) of the total number of moles of T units (T)in the cured product to the total number of moles of silicon atoms (Si)was about 0.43, a ratio (D/Si) of the total number of moles of D units(D) to the total number of moles of silicon atoms (Si) was about 0.29,and a ratio (V/Si) of the total number of moles of vinyl groups (V) inthe cured product to the total number of moles of silicon atoms (Si) was0.

The measurement results of physical properties of the cured products inthe examples and comparative examples were summarized and represented inthe following Table 1.

TABLE 1 Reliability at high temperature Heat and shock durabilityExample 1 A 0/20 Example 2 A 0/20 Example 3 A 0/20 Example 4 B 1/20Comparative C 5/20 Example 1 Comparative C 4/20 Example 2 Comparative C4/20 Example 3 Comparative C 20/20  Example 4 Comparative C 20/20 Example 5

What is claimed is:
 1. A cured product, which is a reaction product of amixture comprising an aliphatic unsaturated bond functionalpolyorganosiloxane and a compound having hydrogen atoms bound to siliconatoms, which comprises a unit of Formula 1:(R₂SiO_(1/2)A_(1/2))  [Formula 1] wherein each R is independentlyhydrogen, an epoxy group, an alkoxy group, or a monovalent hydrocarbongroup, and A is an alkylene group having 2 to 4 carbon atoms, wherein aratio (C/Si) in the cured product of the number of moles of carbon atoms(C) that are present in A to the total number of moles of silicon atoms(Si) is in a range of 0.2 to 0.55, and which comprises an epoxy groupbound to silicon atoms, wherein a ratio (E/Si) of the number of moles ofthe epoxy group (E) to the total number of moles of silicon atoms (Si)is in a range of 0.001 to 0.15.
 2. The cured product of claim 1, whereinthe ratio of (E/Si) the number of moles (E) of the epoxy group to thetotal number of moles of silicon atoms (Si) is in a range of 0.001 to0.1.
 3. The cured product of claim 1, wherein the ratio of (E/Si) thenumber of moles (E) of the epoxy group to the total number of moles ofsilicon atoms (Si) is in a range of 0.001 to 0.05.
 4. The cured productof claim 1, wherein the ratio (C/Si) of the number of moles of carbonatoms (C) which are present in A of Formula 1 to the total number ofmoles of silicon atoms (Si) is in a range of 0.2 to 0.5.
 5. The curedproduct of claim 1, wherein the ratio (C/Si) of the number of moles ofcarbon atoms (C) which are present in A of Formula 1 to the total numberof moles of silicon atoms (Si) is in a range of 0.2 to 0.45.
 6. Thecured product of claim 1, comprising an aryl group bound to the siliconatoms, wherein a ratio (Ar/Si) of the number of moles of the aryl group(Ar) to the total number of moles of silicon atoms (Si) is in a range of0.2 to 1.2.
 7. The cured product of claim 1, comprising a trifunctionalsiloxane unit bound to an aryl group, wherein a ratio (T/Si) of thenumber of moles of the trifunctional siloxane unit (T) to the totalnumber of moles of silicon atoms (Si) is in a range of 0.3 to 0.6. 8.The cured product of claim 1, comprising a difunctional siloxane unit,wherein a ratio (D/Si) of the number of moles of the difunctionalsiloxane unit (D) to the total number of moles of silicon atoms (Si) is0.6 or less.
 9. The cured product of claim 1, comprising a siloxane unitof the following Formula 3:(R¹R² ₂SiO_(1/2))  [Formula 3] where, in Formula 3, R¹ is an alkenylgroup, and R² is a monovalent hydrocarbon group.
 10. The cured productof claim 9, wherein a ratio (V/Si) of the number of moles of thesiloxane unit (V) of Formula 3 to the total number of moles of totalsilicon atoms (Si) is 0.1 or less.
 11. The cured product of claim 1,wherein the aliphatic unsaturated bond functional polyorganosiloxaneshows an average unit of the following Formula 4:P_(a)Q_(b)SiO_((4-a-b)/2)  [Formula 4] where, in Formula 4, P is analkenyl group, Q is an epoxy group, an alkoxy group, or a monovalenthydrocarbon group, a and b are numbers such that a+b is in a range of 1to 2.2, and a/(a+b) is in a range of 0.001 to 0.15.
 12. The curedproduct of claim 1, wherein the compound having the hydrogen atoms boundto the silicon atoms shows an average unit of the following Formula 5:H_(c)Q_(d)SiO_((4-c-d)/2)  [Formula 5] where, in Formula 5, Q is anepoxy group, an alkoxy group, or a monovalent hydrocarbon group, c and dare numbers such that c+d is in a range of 1 to 2.8, and c/(c+d) is in arange of 0.001 to 0.34.
 13. The cured product of claim 1, wherein thecompound having the hydrogen atoms bound to the silicon atoms is acompound of the following Formula 6:

where, in Formula 6, each R is independently hydrogen, an aryl group, anepoxy group, or a monovalent hydrocarbon group, at least one R is anaryl group, and n is a number in a range of 1 to
 2. 14. The curedproduct of claim 1, wherein a ratio (H/Ak) of the number of moles (Ak)of an aliphatic unsaturated bond of the aliphatic unsaturated bondfunctional polyorganosiloxane to the number of moles of the hydrogenatoms of the compound having the hydrogen atoms bound to the siliconatoms (H) is in a range of 1.05 to 1.3 in a mixture.
 15. A semiconductordevice encapsulated by an encapsulant comprising the cured product ofclaim
 1. 16. An optical semiconductor device encapsulated by anencapsulant comprising the cured product of claim
 1. 17. A liquidcrystal display device comprising the optical semiconductor device ofclaim
 16. 18. A lighting device comprising the optical semiconductordevice of claim 16.